Software Engineer (Thermal Analysis for PCB/Package/Chip) (BB-F6B28)
Encontrado en: Neuvoo CR
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software.
Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors.
Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results.
Work leadership may be provided by assigning work and resolving problems.
We’re doing work that matters. Help us solve what others can’t.
calendar_todayhace 2 días